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金,微小箔, Au, 0.01μm厚, 4N
金,微小箔, Au, 0.01μm厚, 4N图片
品牌:Goodfellow
纯度含量:99.99%
产地:英国


产品介绍

CONTRACT COATING of customers' own components or assemblies is available to special order.

This item is normally made to order for delivery within 4-5 weeks.

订货号包装规格
Disc
252-946-2010mm

产品参数

Area Density[面积密度]20.7μg.cm⁻²
Diameter[直径]10mm
Purity[纯度]99.99%
Support[载体]Permanent Mylar® 3.5μm
Thickness[厚度]0.01μm
Typical Analysis(典型分析)
Ag3 PPM
Ca<1 PPM
Cd<1 PPM
Cu1 PPM
Fe<1 PPM
Mg<1 PPM
Pd1 PPM
Si1 PPM
Mechanical Properties(机械性能)
Bulk modulus ( GPa ) ( Hard )171.0
Bulk modulus ( GPa ) ( Soft )171.0
Hardness - Vickers ( kgf mm⁻² ) ( Hard )60
Hardness - Vickers ( kgf mm⁻² ) ( Soft )20 - 30
Material conditionSoft
Material conditionHard
Poisson's ratio ( Hard )0.420
Poisson's ratio ( Soft )0.420
Tensile modulus ( GPa ) ( Hard )78.50
Tensile modulus ( GPa ) ( Soft )78.50
Tensile strength ( MPa ) ( Hard )220.00
Tensile strength ( MPa ) ( Soft )130.00
Yield strength ( MPa ) ( Hard )205.0
Atomic Properties(原子属性)
Atomic number79
Atomic weight ( amu )196.96650
Crystal structureFace Centred Cubic
Electronic structureXe4f¹⁴5d¹⁰6s¹
Ionisation potential ( No./eV )1 / 9.22
Ionisation potential ( No./eV )2 / 20.5
Photo-electric work function ( eV )4.80
Thermal neutron absorption cross-section ( Barns )98.8000
Valences shown1 ,3
Thermal Properties(热性能)
Coefficient of thermal expansion ( x10⁻⁶ K⁻¹ )14.100 @0-100℃
Latent heat of evaporation ( J g⁻¹ )1738
Latent heat of fusion ( J g⁻¹ )64.90
Melting point ( C )1064.40
Specific heat ( J K⁻¹ kg⁻¹ )129.0 @25℃
Thermal conductivity ( W m⁻¹ K⁻¹ )318.00 @0-100℃
Electrical Properties(电气特性)
Electrical resistivity ( μOhmcm )2.2@20℃
Temperature coefficient ( K⁻¹ )0.00400 @0-100℃
Thermal emf against Pt (cold 0C - hot 100C) ( mV )0.74
Physical Properties(物理性质)
Boiling point ( C )3080
Density ( g cm⁻³ )19.300 @20℃

其他参数

公差

薄度±30%
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